Aavid thermalloy srl (Componentes Electromecanicos)


Cooling Products

Search a broad variety of off-the-shelf and custom heat sinks including copper and aluminum board level heat sinks, heat sinks for BGA and CPU devices, extrusion profiles, liquid cold plates, heat pipes, heat sink interface materials, attachment methods...

Thermal Design Resources

Applications engineers join customer's design teams to support a global roster of product development projects. They perform thermal analysis, plus provide design expertise and manufacturing cost optimization services.... 

 
Productos:
Device Cooled Product Line
  • Standard Electrical Packages
    Off-the-shelf cooling solutions for standard electrical packages, such as TO-220, TO-3, DIP, and many others. Copper and aluminum heat sinks.
  • Extrusion Profiles
    Use our selector to pinpoint the right extrusion from the many profiles available.
  • Surface Mount
    A line of low profile surface mount heat sinks suitable for SMT power semiconductors devices in D-PAK, D2PAK, D3PAK, and SO-10 packages.
  • Max Clips™
    Clip and rail thermal solutions for power transistors. A high performance, low cost way to eliminate mounting holes, screws, rivets, and thermal inefficiency.
  • Ball Grid Arrays (BGA)
    A family of BGA heat sinks offers a wide range of cooling solutions for motherboard, video card, and networking applications.
  • DC to DC Converters
    Heat sinks designed to match popular DC to DC converter packages, extending their life and performance.
  • Electrolytic Capacitors
    Cap Coolers improve the performance and extend the life of 3" diameter electrolytic capacitors.
  • Bonded Fin Heat Sinks
    Bonded Fin technologies cool high power applications with high fin densities unavailable in extrusions.
  • IGBT Modules
    Choose from several options for cooling IGBT modules - cold plates, extrusions, bonded fin, and fan heat sinks.
  • LED Light Sources
    Aavid's wide selection of standard heat sinks provides easy, fast access to cooling solutions for the new generation of LED light sources from Lumileds™.
  • Folded Fin Heat Sinks
    Folded Fin technology adds surface area to cool high power applications in a lightweight package. Folded fin assemblies offer maximum forced air cooling in a minimum volume.
  • Microprocessors
    Complete cooling solutions are available for popular microprocessors, including interface material and attachment methods. Copper Cpu heat sinks available.
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